ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,692, issued on Jan. 20, was assigned to MasterCard International Inc. (Purchase, N.Y.). "Artificial intelligence based methods and systems ... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,692, issued on Jan. 20. "Bottle" was invented by David Colin Zevetchin (Oxford, Conn.), Christopher Buckman (Oxford, Conn.) and Ralph Lynch... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,523, issued on Jan. 20, was assigned to MOW Equipment Solutions Inc. (Linwood, Kan.). "Systems and methods for railway equipment control" w... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,224, issued on Jan. 20, was assigned to SAP SE (Walldorf, Germany). "High throughput machine learning model runtime using CPU affinity and ... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,648, issued on Jan. 20, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-Do, South Korea). "Display device" was invented by Sang-Woo Han ... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. D1,109,762, issued on Jan. 20, was assigned to Apple Inc. (Cupertino, Calif.). "Display screen or portion thereof with animated graphical user int... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,297, issued on Jan. 20, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Method and apparatus for transmitting initial acc... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,180, issued on Jan. 20, was assigned to MOBILE ROBOT TECHNOLOGIES LLC (Wilmington, Del.). "Mobile robot" was invented by Stefan Stoyanov (V... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,784, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South, South Korea). "Integrated circuit chip and semiconductor packa... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,678, issued on Jan. 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method for manufacturing semico... Read More